On January 9, 2025, Shengrun Technology officially launched the SIP Bluetooth chip using a new packaging process. This chip is not only smaller in size and has simpler peripheral components and circuits, but also achieves a double improvement in overall performance and cost-effectiveness, bringing a new solution to the IoT market.
Shengrun Technology has been committed to technological innovation and product development in the field of wireless communications. The SIP Bluetooth chip released this time is undoubtedly another major breakthrough of the company in Bluetooth technology. Compared with traditional Bluetooth modules, SIP (System In Package) chips have greatly reduced their size through highly integrated design, allowing device manufacturers to design miniaturized and lightweight electronic products more flexibly. At the same time, the simplification of peripheral components and circuits also reduces production and maintenance costs and improves the market competitiveness of products.
This Bluetooth chip is widely used
Sports and health: sports bracelets, pedometers, sports measurement (running, cycling, golf)
Smart home: socket modification, remote control switch, dimming and color adjustment lighting, door locks, curtains, thermometer and hygrometer, smart scale, environmental smoke detector, pet supervision.
Health and medical: medical testing/tracking (heart rate, blood pressure, blood oxygen, pulse, body temperature).
Infant care: real-time temperature detection, smart crib, and anti-loss.
Toys: interactive remote control toys, robots, aircraft, toy cars, anti-lost devices.
Automotive electronics: tire pressure detection, car automatic lock, parking space record, electric vehicle anti-theft device, data acquisition monitoring.
Human-machine interface: HID keyboard, mouse, remote control, handle.
In addition to the SIP Bluetooth chip, Shengrun Technology also revealed that it will gradually launch a series of new wireless communication modules such as WIFI+SIP chip, Zigbee+SIP chip, UWB (Ultra Wideband) + SIP chip in the future. These modules will combine the advantages of SIP technology to further enhance the performance and cost-effectiveness of various wireless communication technologies, providing strong support for the diversified development of the Internet of Things market.
Shengrun Technology's SIP Bluetooth chip has been initially applied in smart home, wearable devices, medical electronics and other fields, and has won unanimous praise from customers. With the launch of more SIP wireless communication modules in the future, Shengrun Technology is expected to become one of the leading companies promoting the development of the industry.
The successful holding of this new product launch conference not only demonstrated Shengrun Technology’s strong strength in technological innovation and product development, but also injected new vitality into the future development of the Internet of Things market. We look forward to Shengrun Technology continuing to leverage its strengths to bring more high-quality and efficient products and services to the market.
