Product introduction
HY-330001 module is a WIFI wireless module based on TI (Texas Instruments) CC3300 as the core design. Wifi supports IEEE 802.11b /g/n/ax MAC, baseband and radio-frequency transceivers, 2.4GHz, 20MHz, single-space streaming, hardware-based encryption and decryption, supports WPA2 and WPA3, supports 4-bit SDIO or SPI host interface, Application throughput up to 50Mbps. The module is packaged with a 44PIN stamp hole, the size is 12*12*2.5mm (including shielding cover).
Product characteristics
➢ Wi-Fi 6 (802.11ax); ➢ 2.4GHz Wi-Fi 6 and Bluetooth Low Energy 5.4 supporting IC; ➢ Companion IC for any processor or MCU host capable of running the TCP/IP stack; ➢ Integrated 2.4GHz PA for complete wireless solutions with output power up to +20dBm; ➢ Operating temperature: -40°C to +85°C; ➢ Application throughput up to 50Mbps; ➢ Enhanced security - secure host interface - Firmware authentication - anti-rollback protection; ➢ Multi-role support (for example, concurrent STA and AP), which can connect Wi-Fi devices on different RF channels (Wi-Fi networks); ➢ Power Management - VIO: 1.8V - VBAT: 3.0V to 3.6
Matters needing attention
Pay attention to installation and use to prevent strong damage to all parts of the module (including shielding cover,PCB);
Pay attention to electrostatic protection. During operation, ensure that instruments and equipment are fully grounded and anti-static protection to prevent static electricity caused by poor grounding of cautering iron and equipment, damaging IC and program being shot away; When manual welding, pay attention to the temperature of the soldering iron to avoid peeling off the PCB copper skin; The soldering iron is strictly required to be completely grounded to avoid the soldering iron power supply damaging the module; Operators should wear anti-static rings, and carry out electrostatic protection inspection to prevent human touch to damage the IC and program;
The ground resistance of the soldering iron welding head is less than 10Ω, and the leakage voltage is less than 0.1V. Ensure that the contact between the soldering iron head and the soldering iron head cover is good to avoid poor oxidation contact. The electrostatic voltage of the environment and personnel is within 0±100V. Esd labels are placed on the operation area. Use high-efficiency electrostatic ion fan to remove all kinds of static electricity generated in the working environment (such as: human body, packaging tools, instruments and equipment). Static electricity generated by etc.);
Note that the product circuit design needs to have appropriate overvoltage protection circuit to prevent short circuit or open circuit during welding, and the power supply is on/off instantly resulting in abnormal voltage supply to the Bluetooth chip, resulting in the program being knocked away and the IC being destroyed;
When flash memory is burning program firmware, the VDDS DC power supply voltage should be between 2.4~3.3V to avoid incomplete abnormal conditions during burning.
The firmware may be locked if the source voltage falls within the threshold value (1.76V to 1.78V) of the BOD Brown-Out Dectect for multiple times (in the Lock-up area for power failure detection as shown below), causing a Boot Code Startup code suspends execution, cannot connect to JTAG protocol; If this state occurs, the reset pin can be reset below 1.0V to remove this phenomenon; At the same time, when applicable: ensure the voltage setting value of the rechargeable battery protection system; Pay attention to the voltage drop caused by the internal resistance of the supply power and the line impedance; Ensure that the operating voltage of the device is between 1.8V and 3.8V, and ensure that the supply voltage slope is faster than 0.5V/ms(when crossing the BOD critical value);
In the production and transportation process, please make good part protection measures to prevent precision parts from crashing (backwelding furnace outlet and assembly, testing, transportation process, it is recommended to use anti-collision materials buffer, can not collide with each other);
This IC is a humidity sensitive component. Please strictly follow IPC/ JEDECJ-STD-020 and dry and dehumidify the chip when using it for reflow soldering.
