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Shengrun Technology showcased its latest research and development results, including the latest hardware products and related IoT solutions. These products cover automotive digital keys, TPMS (tire pressure monitoring system), BMS (battery management system), MPPT (maximum power point tracking), smart meters, smart power tools, smart medical equipment, security access control, smart wearables, etc. field, fully demonstrating Shengrun Technology's profound strength and forward-looking vision in the field of Internet of Things.

On January 9, 2025, Shengrun Technology officially launched the SIP Bluetooth chip using a new packaging process. This chip is not only smaller in size and has simpler peripheral components and circuits, but also achieves a double improvement in overall performance and cost-effectiveness, bringing a new solution to the IoT market.

On the day of the exhibition, TTC will showcase its latest research and development achievements, including the latest hardware products and related IoT solutions. Covering multiple fields such as vehicle networking, BMS, MPPT, smart meters, smart power tools, smart medical equipment, security access control, and smart wearables. Assist in the automation and intelligent upgrading of the industry.

The HY-27PX series Bluetooth modules use a 96 MHz Arm®Cortex®-M33 processor, fully support the Bluetooth 5.3 standard, and meet users' urgent needs for efficient and stable wireless connections with ultra-high-speed data transmission capabilities and ultra-low latency performance. It can fully meet the needs of automotive products. The HY-27PX series can easily cope with other IoT application fields.

At the exhibition site, the booth of Shengrun Technology became one of the highlights. The company made its debut with its newly developed IoT communication solutions and star products, fully demonstrating its deep accumulation and strong strength in the fields of wireless communications, intelligent hardware and system integration. From wireless communication modules such as low-power Bluetooth (BLE), Zigbee, Wi-Fi 6 to ultra-wideband (UWB),

Both HY-52P101P and HY-52P701P modules use TI CC2652 chip, which is a micro wireless module with integrated Zigbee communication protocol stack and supports the latest protocol Zigbee3.0. It is convenient for developers to quickly build Zigbee network. This module usually has the characteristics of low power consumption, small size, easy integration, supports multiple interfaces and protocols, and can easily access various terminal devices.